| 发明名称 |
HIGH DENSITY SUBSTRATE AND METHODS FOR MANUFACTURING SAME |
| 摘要 |
This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using the substrates to manufacture laminates, circuits, interposers, and other electronic laminates.
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| 申请公布号 |
WO0078107(A1) |
申请公布日期 |
2000.12.21 |
| 申请号 |
WO2000US16220 |
申请日期 |
2000.06.14 |
| 申请人 |
ALLIEDSIGNAL INC. |
发明人 |
SMITH, GORDON;GOTRO, JEFFREY, T.;HEIN, MARC;ANDROFF, NANCY, M., W. |
| 分类号 |
H05K1/09;B32B15/08;H05K3/00;H05K3/02;H05K3/06;H05K3/18;H05K3/42;(IPC1-7):H05K3/02 |
主分类号 |
H05K1/09 |
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