| 摘要 |
<p>A mounting circuit and a printed wiring board, in each of which a composition/size on a circuit is uniform, a position accuracy is good and a solder bump is formed, and a mounting material for forming them, are provided. The mounting material is characterized in that a solder layer (10), a nickel layer (11) and a copper layer (12) are laminated in this order. Further, the mounting material is characterized in that, in its one face, the copper layer (12) having the nickel layer (11) and the solder layer (10) are laminated in order, with the nickel layer (11) being an intermediate layer. Further, in the mounting material, a resin film (20) is laminated on a copper layer (12) side of the mounting material (14).</p> |
