发明名称 |
ELECTRONIC DEVICE COMPRISING A CHIP FIXED ON A SUPPORT AND METHOD FOR MAKING SAME |
摘要 |
The invention concerns a method for making a device comprising a support associated with at least a microcircuit in the form of a chip, and comprising, for the or each chip, the following steps which consist in: a) first providing for said chip an assembly consisting of a thin chip maintained by one first surface to a protective substrate and having on said first surface at least a bond pad (8); b) transferring said assembly onto a surface (16a) of the support, with a second surface of the chip opposite the first, facing said support surface; c) removing the protective surface so as to expose said chip first surface; and d) producing at least part of a communication interface covering the chip first surface at the level of at least a bond pad and a surface portion (16a) of the support. |
申请公布号 |
WO0077730(A1) |
申请公布日期 |
2000.12.21 |
申请号 |
WO2000FR01493 |
申请日期 |
2000.05.30 |
申请人 |
GEMPLUS;CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE;PATRICE, PHILIPPE |
发明人 |
CALVAS, BERNARD;FIDALGO, JEAN-CHRISTOPHE;PATRICE, PHILIPPE |
分类号 |
G06K19/077;H01L21/60;H01L23/498 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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