发明名称 |
METHOD FOR THERMALLY ANNEALING SILICON WAFER AND SILICON WAFER |
摘要 |
<p>According to the present invention, there are provided a method for heat treatment of silicon wafers wherein a silicon wafer is subjected to a heat treatment at a temperature of from 1000 DEG C to the melting point of silicon in an inert gas atmosphere, and temperature decreasing in the heat treatment is performed in an atmosphere containing 1-60% by volume of hydrogen, a method for heat treatment of silicon wafers under a reducing atmosphere containing hydrogen by using a rapid heating and rapid cooling apparatus, wherein temperature decreasing rate from the maximum temperature in the heat treatment to 700 DEG C is controlled to be 20 DEG C/sec or less, and a silicon wafer which has a crystal defect density of 1.0 x 10<4> defects/cm<3> or more in a wafer bulk portion, a crystal defect density of 1.0 x 10<4> defects/cm<3> or less in a wafer surface layer of a depth of 0.5 mu m from the surface, a crystal defect density of 0.15 defects/cm<2> or less on a wafer surface and surface roughness of 1.0 nm or less in terms of the P-V value. By these, crystal defects in wafer surface layers can be reduced by a simple method with a small amount of hydrogen used without degrading microroughness of wafers. <IMAGE></p> |
申请公布号 |
EP1061565(A1) |
申请公布日期 |
2000.12.20 |
申请号 |
EP19990959892 |
申请日期 |
1999.12.17 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD |
发明人 |
KOBAYASHI, NORIHIRO;AKIYAMA, SHOJI;MATSUMOTO, YUUICHI;TAMATSUKA, MASARO |
分类号 |
H01L21/322;(IPC1-7):H01L21/26 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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