INTEGRATED CIRCUIT PACKAGE HAVING A SUBSTRATE VENT HOLE
摘要
The present invention involves a method of providing an integrated circuit package (10) having a substrate with a vent opening (15). The integrated circuit package includes a substrate (12) having an opening and an integrated circuit mounted (18) to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.
申请公布号
WO0078103(A1)
申请公布日期
2000.12.21
申请号
WO2000US40107
申请日期
2000.06.05
申请人
INTEL CORPORATION;RAMALINGAM, SURESH;VODRAHALLI, NAGESH;COSTELLO, MICHAEL, J.;LOKE, MUN, LEONG;MAHAJAN, RAVI, V.
发明人
RAMALINGAM, SURESH;VODRAHALLI, NAGESH;COSTELLO, MICHAEL, J.;LOKE, MUN, LEONG;MAHAJAN, RAVI, V.
