发明名称 LASER MACHINING APPARATUS, AND APPARATUS AND METHOD FOR MANUFACTURING A MULTILAYERED PRINTED WIRING BOARD
摘要 <p>A multilayer printed wiring board manufacturing apparatus comprising a CO2 laser source (60), a scanning head (70) for deflecting the direction of laser beam in the X-Y table (80) for displacing the position of the multilayer printed wiring board, wherein the laser beam oscillated from said CO2 laser source is converted to the beam of shortened wavelength by harmonic wave generating means (94).</p>
申请公布号 EP0884128(A4) 申请公布日期 2000.12.20
申请号 EP19970912474 申请日期 1997.11.14
申请人 IBIDEN CO., LTD. 发明人 HIRAMATSU, YASUJI
分类号 B23K26/04;B23K26/06;B23K26/067;B23K26/08;B23K26/38;H05K1/02;H05K3/00;H05K3/46;(IPC1-7):B23K26/00;B23K26/02 主分类号 B23K26/04
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