发明名称 |
Method for manufacturing a package structure having a heat spreader for integrated circuit chips |
摘要 |
A method for manufacturing package structure integrated circuit chips having a heat spreader is disclosed. A wiring substrate is first provided. An integrated circuit chip, having a first surface and a second surface, is then electrically and mechanically connected to the wiring substrate via a first set of solder joints. A heat spreader is subsequently connected to the second surface of the integrated circuit chip via a second set of solder joints. The heat spreader includes an adhesion-promotion layer on a silicon layer.
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申请公布号 |
US6162659(A) |
申请公布日期 |
2000.12.19 |
申请号 |
US19990263033 |
申请日期 |
1999.03.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WU, LEON LI-HENG |
分类号 |
H01L23/36;H01L23/433;H01L23/498;(IPC1-7):H10L21/44 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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