| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin package substrate where a conductive connection pin hardly separates off. SOLUTION: A conductor layer 5 is formed on a board, and pads 16 are formed for fixing conductive connection pins 100 to a package board 310, where fixing conductive connection pins 100 are fixed for being electrically connected to a mother board. The pads 16 are covered with an organic resin insulating layer 15, where openings 18 are provided so as to partially expose the pads 16, and the conductive connection pins 100 are fixed to the pads 16 with a conductive adhesive agent 17, by which the conductive connection pins 100 hardly separate from the board. |
