| 摘要 |
PROBLEM TO BE SOLVED: To electrically separate mother board connection electrodes from each other through etching, without mechanically boring a hole in a board with a die and to make plating leads as short as possible. SOLUTION: A semiconductor device mounting relay board is fabricated through the steps of a step A, where a conductor circuit 4 that contains mother board connection electrodes 2 and plating leads 3 is formed on an insulating base film 1, a step B where a patterning resin 5 is formed on the conductor circuit 4, a step C where the patterning resin layer 5 is etched so as to make the mother board connection electrodes 2 and the plating leads 3 exposed, a step D where the plating leads 3 are each coated with an electroplating resist layer 6, a step E where an electroplating metal layer 7 is laminated on the exposed mother board connection electrodes 2 respectively, a step F where the electroplating resist layer 6 is removed, a step G where the exposed plating leads 3 are removed through etching, and a step H where a polyimide precursor layer is turned fully to an imide, when the patterning resin layer 5 is a polyimide precursor layer. |
