MANUFACTURE OF SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To satisfactorily deal with the problem of wafer edge by printing a first pattern in a wafer area where no edge effect is anticipated and printing an enlarged pattern in an area where more tendency of influence of the effect is anticipated. SOLUTION: A frame 31 of a reticle 30 is used for supporting a patterned mask which forms a main section 32 and two spare sections 34A and 34B. The main section 32 corresponds to a fully functional square area and prints a first pattern in an area which will not be influenced by any edge effect whatsoever. Also, it prints an enlarged pattern in non-functional edge area where likely influence of the effect is anticipated. In this way, the effect of nonuniformity can be improved and the problem of wafer edge can be dealt with satisfactorily.