发明名称 |
Semiconductor integrated circuit |
摘要 |
In order to solve the above-described problem, a semiconductor integrated circuit according to the present invention comprises a semiconductor chip, a core area formed over the semiconductor chip and comprised of predetermined circuits, and a plurality of input/output unit cells placed along peripheral edge portions of the semiconductor chip so as to surround the core area and shaped in the form of bent patterns. Further, a semiconductor integrated circuit according to another invention comprises a semiconductor chip, a core area formed over the semiconductor chip and comprised of predetermined circuits, and a plurality of input/output unit cells placed aslant toward peripheral portions of the semiconductor chip so as to surround the core area.
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申请公布号 |
US6163042(A) |
申请公布日期 |
2000.12.19 |
申请号 |
US19980184848 |
申请日期 |
1998.11.03 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
MIZUSHIMA, TAKEO;MASUDA, HIROHISA |
分类号 |
H01L21/822;H01L27/02;H01L27/04;(IPC1-7):H01L27/10 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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