发明名称 Semiconductor integrated circuit
摘要 In order to solve the above-described problem, a semiconductor integrated circuit according to the present invention comprises a semiconductor chip, a core area formed over the semiconductor chip and comprised of predetermined circuits, and a plurality of input/output unit cells placed along peripheral edge portions of the semiconductor chip so as to surround the core area and shaped in the form of bent patterns. Further, a semiconductor integrated circuit according to another invention comprises a semiconductor chip, a core area formed over the semiconductor chip and comprised of predetermined circuits, and a plurality of input/output unit cells placed aslant toward peripheral portions of the semiconductor chip so as to surround the core area.
申请公布号 US6163042(A) 申请公布日期 2000.12.19
申请号 US19980184848 申请日期 1998.11.03
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 MIZUSHIMA, TAKEO;MASUDA, HIROHISA
分类号 H01L21/822;H01L27/02;H01L27/04;(IPC1-7):H01L27/10 主分类号 H01L21/822
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