发明名称 Method of defining a conductive layer
摘要 A method of defining the conductive layer is described in which a substrate comprises a dielectric layer and a conductive layer is formed covering the entire substrate. A common photolithography and etching process is conducted to form a wide trench pattern. An adjustment structure is also formed next to the sidewall on both sides of the trench such that the distance between the adjustment structures is same as the desired width of the conductive structure. After which, a cover layer is formed to fill the trench. Using the cover layer as a self-aligned hard mask, an anisotropic etching process is conducted to form a conductive structure.
申请公布号 US6162731(A) 申请公布日期 2000.12.19
申请号 US19990330432 申请日期 1999.06.08
申请人 UNITED SILICON INCORPORATED;UNITED MICROELECTRONICS CORP. 发明人 LIAO, KUAN-YANG
分类号 H01L21/033;H01L21/3213;(IPC1-7):H01L21/00 主分类号 H01L21/033
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