| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily mount a chip on a substrate, without being affected by the thermal expansion of the feed mechanism of a Z-axis feed device and the like, when a tool is lowered and the chip is mounted on the substrate, being supported by a stage and also to enable correction of the shape of the bump of the chip. SOLUTION: With a tool holder 17, mounted on a holder support means 15 capable of being vertically moved by a Z-axis feed device 32 via a static pressure air bearing 18, a tool 2 capable of holding a chip 1 is mounted on the holder 17 and moreover, a height-detecting means 23, which detects the height position of the holder 17 and feeds back the height position to a drive control means 22 of the device 32, is mounted on the means 15, and the means 15 has a pressing port 19 and a balance pressure port 20. |
