| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce fluctuation in the resistance of a thick film resistor on a multilayer circuit board by containing a specific quantity of Ag and/or Ag compound in the insulating layers on the multilayer circuit board. SOLUTION: A multilayer circuit board 1 has insulating layers 2a, 2b, 2c, 2d, 2e, 2f, 2g, and 2h laminated in this order, and has Ag inner layer conductor patterns 3a, 3b, 3c, and 3d, thick film resistors 4a and 4b predominantly composed of ruthenium oxide or the like, and various circuit patterns, such as capacitors, coils, and wiring, formed in via holes 5 and the like formed therein. On the major surface of the multilayer circuit board 1 on one side, surface-layer conductor patterns such as electrode pads and surface wiring are formed, and surface mount components 7 such as a chip capacitor, a semiconductor IC chip 8, a thick film resistor 9, and the like are connected with the surface-layer conductor patterns and the inner layer conductor patterns. The insulating layers contain 0.001 to 5 wt.% of Ag and/or Ag compound in terms of metal Ag.</p> |
