发明名称 FILM DEFECT INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To inspect a defect of a film formed on a substrate of a relatively rough surface by a light interferometer method. SOLUTION: Light with longer wavelength than surface roughness Rmax or Rz of a substrate that a film is formed is irradiated to the substrate. Thereby, a defect of the film formed is inspected by obtaining interference fringes 5, 6. Specially, it is preferable that light with wavelength 500 nm or above is irradiated when the Rmax or Rz is 0.5μm or above, or light with longer wavelength than Rmax or Rz over a range between Rmax and Rz is irradiated to the substrate. A surface of the substrate is cut. Specifically, defects of an electric discharge generating layer of an electrophotography photoreceptor 8, electric discharge transporting layer or undercoating layer can be inspected. This photoreceptor 8 is mounted on a digital copy machine and printer. Also, irradiating homogeneous light is preferable. Irradiating indirect light of light reflected by a reflector plate or light diffused by a diffuser plate is also preferable.
申请公布号 JP2000352504(A) 申请公布日期 2000.12.19
申请号 JP19990320195 申请日期 1999.11.10
申请人 SHARP CORP 发明人 FUJITA SAYAKA;TAKEZAWA YOICHI;SHIMODA YOSHIHIDE;MORITA TATSUHIRO;MATSUO RIKIYA;SAKAMOTO MASAYUKI;TORIYAMA KOICHI
分类号 G01B11/06;G01B11/30;G01N21/84;G01N21/95;G03G5/00;(IPC1-7):G01B11/06 主分类号 G01B11/06
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