| 发明名称 |
Lead frame attachment for optoelectronic device |
| 摘要 |
An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder. |
| 申请公布号 |
US6162653(A) |
申请公布日期 |
2000.12.19 |
| 申请号 |
US19980159256 |
申请日期 |
1998.09.23 |
| 申请人 |
BOOKHAM TECHNOLOGY, PLC |
发明人 |
MAUND, BRIGG |
| 分类号 |
G02B6/42;G02B6/30;H01L23/02;H01L23/08;H01L23/48;H01L31/0232;H01L33/62;H01S5/022;(IPC1-7):H01L21/00;H01L33/00;H01L23/34 |
主分类号 |
G02B6/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
