发明名称 |
Method for fabricating a surface mounting type semiconductor chip package |
摘要 |
A solder structure for a surface mounting type semiconductor chip package, and a method of fabricating the same are disclosed. The surface mounting type semiconductor chip package includes a package body having an interconnection formed therein and a semiconductor chip accommodated therein, and a plurality of double layer bumps each attached to the bottom of the package body as an external connection terminal. |
申请公布号 |
US6162664(A) |
申请公布日期 |
2000.12.19 |
申请号 |
US19980168886 |
申请日期 |
1998.10.09 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
KIM, JIN-SUNG |
分类号 |
H01L23/12;H01L23/13;H01L23/24;H01L23/28;H01L23/31;H01L23/498;H05K3/34;(IPC1-7):H01L21/50;H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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