发明名称 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
摘要 |
An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.
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申请公布号 |
US6162878(A) |
申请公布日期 |
2000.12.19 |
申请号 |
US19990310999 |
申请日期 |
1999.05.13 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
OSADA, SHOICHI;TOMIYOSHI, KAZUTOSHI;ASANO, EIICHI;AOKI, TAKAYUKI;SHIOBARA, TOSHIO |
分类号 |
C08G59/08;C08G59/20;C08G59/40;C08G59/62;C08K3/00;C08L61/04;C08L63/00;C08L83/04;H01L23/29;H01L23/31;(IPC1-7):C08G59/08 |
主分类号 |
C08G59/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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