| 摘要 |
A carrier head for a chemical mechanical polishing apparatus includes a base and a flexible membrane extending beneath the base to define a pressurizable chamber. The flexible membrane may be secured to the base, to a retaining ring surrounding the mounting surface, or to a support structure movably connected to the base by, for example, an adhesive, an O-ring seal, a sealant, or by fitting the membrane into a recess. A lower surface of the flexible membrane provides a mounting surface for a substrate.
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