发明名称 MANUFACTURE OF WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To enable projections which are in a stable shape to be easily formed always in a manufacturing method, where a wiring board is manufacturing through an intaglio transfer printing. SOLUTION: In a process, where grooves 3 and 4 are cut in a film 2 for the formation of an intaglio 5, and a conductive material 6 is filled into the grooves 3 and 4, the conductive material 6 is dried out in such a manner where a drying operation is carried out under a reduced pressure or by rotating the intaglio 5 under a reduced pressure for centrifugal drying to take advantage of the fact that a solvent component is liable to evaporate easily under reduced pressure, and air bubbles are prevented from penetrating into the grooves, so that the conductive material 6 can be filled efficiently into the grooves 3 and 4 up to their deepest points. Therefore, a wiring pattern 11 and projections 12 can be formed on a board in one piece and at the same time, and moreover the projections 12 can be easily and formed in a stable shape at all times.</p>
申请公布号 JP2000353761(A) 申请公布日期 2000.12.19
申请号 JP19990164895 申请日期 1999.06.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAWAMOTO EIJI;HAYAMA MASAAKI;MIURA KAZUHIRO;TAKASE YOSHIHISA
分类号 H05K3/20;H01L21/60;H01L23/12;(IPC1-7):H01L23/12 主分类号 H05K3/20
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