| 发明名称 |
Bonding apparatus |
| 摘要 |
In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed. |
| 申请公布号 |
US6161747(A) |
申请公布日期 |
2000.12.19 |
| 申请号 |
US19990249354 |
申请日期 |
1999.02.12 |
| 申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
USHIKI, HIROSHI;SUGIURA, KAZUO;TAKAHASHI, KOICHI |
| 分类号 |
H01L21/60;B23K20/00;B23K20/10;H01L21/52;H01L21/68;(IPC1-7):B23K37/00;B23K31/02;B23K31/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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