| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an LED module mounting stage of high reliability, wherein an LED module is aligned finely with high accuracy, while being superior in stability of electrical connection. SOLUTION: On a channel forming member 12, a sub-through hole 16 is so formed as to partially overlap a through-hole 15 (through-hole for side through), which is a scheduled formation region for a wiring channel of a side part which is formed for electrical connection path to a rear surface side. The through-hole 15 as a region, where a side part wiring channel is to be formed, is exposed to the outside by a larger part, promoting formation of a metal film (plating) to satisfactory conditions. The position where the sub-through hole 16 is formed is in a cut region 17, along the side part of a small unit stage. Since the sub-through hole 16 is almost substantially removed later, there is substantially no effect given to the stage. |
