| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the size of a mother board by providing feed-through electrodes which electrically connect the board terminals of a mother board with the input/output terminals of an integrated circuit and are insulated from first and second external electrodes and internal electrode layers. SOLUTION: A carrier board 2 incorporates (n) internal electrode layers 16a and 16b and n-1 dielectric layers 17 sandwiched between the internal electrode layers 16, respectively. The carrier board is also provided with a first external electrode 11a electrically connected with nth, (n-2)th,... internal electrode layers 16, and a second external electrode 11b electrically connected with (n-1)th, (n-3)th,... internal electrodes 16b. These external electrodes 11 are provided with outgoing electrodes 14 and 24 which are exposed to the external of the board 2 for electrically connecting the board terminals 8 of a mother board 3 with the input/output terminals 5 of an integrated circuit 1. Feed-through electrodes 23 are insulated from the external electrodes 11 and the internal electrode layers 16a and 16b.</p> |
