| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the manufacturing method of a semiconductor device to enable a large quantity production using semiconductor elements, which are called 'small chips', in a mass production process, in flip-chip mounting. SOLUTION: When bump electrodes 2 are formed on electrode pads of semiconductor elements 11, the formation of the electrodes 2 is performed in a state of a chip block 10 which consists of a plurality of the semiconductor elements 11, and after that, the electrodes 2 are to be treated in a state of the individual semiconductor element. Accordingly, the manufacturing tact time at the formation of the electrodes 2 is shortened significantly, the manufacturing lead time of a flip-chip mounting is shortened, and an effective manufacturing process can be realized. Especially when the size per one chip is small, such as the case where a multitude of the elements 11 are formed within one sheet of a semiconductor wafer, as much manufacturing time for the formation of the electrodes 2 is required as for the small component, and by shortening this time, the manufacturing lead time of the flip-chip mounting can be shortened as a whole.</p> |
