| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist processing apparatus, where without changes in the concentration of a developer liquid, the dissolved gas component and air bubbles in it are removed. SOLUTION: A developer liquid is allowed to make contact with a resist film coated on a substrate for developing a resist film. Here, a nozzle which discharged/supplies a developer liquid to a resist film a developer liquid feeding means which guides in a pressurized gas to a developer liquid supply source so that the developer liquid is fed under gas pressure toward the nozzle, and a processor liquid degassing mechanism, which provided between the developer liquid feeding means and the nozzle, degasses the developer liquid before discharged through the nozzle, are provided. A processor liquid degassing mechanism 300 comprises a first tube 308 of a first diameter and a porous material, a second tube 310 of a porous material, which having a second diameter larger than that of the first one, forms a flow path where the developer liquid flows with a first tube 108, a third tube 312 of a nonporous material which has a third diameter larger than that of the second one, an inside exhaust means 322 provided inside the first tube 108, and an outside exhaust means 324 between the second tube 310 and the third tube 312. |
