| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering material which is small in initial void generation ratio, excellent in heat fatigue resistance in soldering parts largely different in coefficient of thermal expansion from each other, and capable of improving the level in die bonding an IC chip by specifying the Pb content and the Bi and Sb contents in the soldering material having the composition consisting of Sn, In and Ag of specified ratio and the balance Pb with inevitable impurities. SOLUTION: The soldering material has the composition consisting of, by weight, 2.0-3.0% Sn, 0.001-0.2% In, 0-2.0% Ag, and the balance Pb with inevitable impurities, and the Pb content is 95.5-97.99%, and the Bi and Sb contents are <=0.005%. In addition, metallic or non-metallic particles of high melting point are preferably contained by 0.001 to 5.0%, and the soldering material is suitable for soldering the IC chip to a substrate having a Ni or Cu surface. The particles of high melting point include metallic particles such as Cu and Ni, and non-metallic particles of oxide such as SiO2 and carbide such as SiC. |
