FILM FORMATION METHOD AND FILM FORMATION APPARATUS

摘要

PROBLEM TO BE SOLVED: To form a uniform film of a treatment liquid on a substrate with no vain supply of the treatment liquid to the substrate. SOLUTION: While a wafer W being rotated, a resist liquid jetting nozzle N1 for jetting a resist liquid to the wafer W is moved at an equal speed along the radial direction of the wafer W. During the movement, the amount of the resist liquid to be jetted out of the resist liquid jetting nozzle N1 is gradually lessened. The resist liquid jetted to the wafer W is applied to the surface of the wafer W while drawing the spiral track and the amount of the resist liquid applied to a unit surface area is even in the peripheral part B and in the center part C of the wafer W.