发明名称 MANUFACTURE OF MUTILAYER WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To manufacture a multiplayer wiring board incorporating a thick film resistor having a highly accurate resistance in which blurring of resistor ink and conductor ink is retarded through small number of steps. SOLUTION: The method for manufacturing a multiplayer wiring board by laying an upper layer wiring board on a lower layer wiring board provided with a resistor 82 having desired length and width comprises a step for forming two separated insulator layers 85 on an insulating substrate 81, a step for forming a resistor having a width defined by two insulator layers by applying resistor ink to fill the gap between two insulator layers, a step for forming a lower layer wiring board by forming an electrode layer 83, in layer, at the opposite end parts of the resistor in the longitudinal direction, and a step for firing the upper layer wiring board while laying it on the lower layer wiring board thus formed.</p>
申请公布号 JP2000353876(A) 申请公布日期 2000.12.19
申请号 JP19990163877 申请日期 1999.06.10
申请人 SHARP CORP 发明人 KAWASAKI TOKIO
分类号 H01C17/06;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01C17/06
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