| 摘要 |
An integrated circuit provides self-heating in order to assist an externally applied thermal control unit raise the temperature of the integrated circuit to a specified range of temperatures at which functional testing is conducted. In a particular embodiment of the present invention, a packaged integrated circuit that is thermally coupled to a heat dissipating device, including but not limited to a heat sink, is operated in a high power manner prior to functional testing, so as to quickly raise internal junction temperatures to a specified test range before functional testing begins.
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