| 摘要 |
The present invention proposes a heat spreader for a ball grid array package. In a ball grid array package, a chip is attached to a first surface of a substrate by adhesives. Bonding areas on the first surface of the substrate adjoining to where the chip is attached are connected to the chip through metal leads. Solder balls formed on the first surface of the substrate are soldered to another device such as a motherboard. A metal heat spreader having a protuberance covers on the chip. The protuberance of the heat spreader contacts the chip to enhance the heat dissipating effect of the chip.
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