发明名称 BONDING METHOD FOR MICRO BEADS OF PHOTOELECTRIC ELEMENT
摘要 PROBLEM TO BE SOLVED: To improve performance of a photoelectric element, such as LED array and laser diode by causing automatic self-alignment to take place between micro beads and a metal frame through fusion of an adhesive film at the start of heating, for providing the micro beads with very accurate positions. SOLUTION: A metal frame 2 is formed at a prescribed position of a substrate of a photo-electric element 10, and the substrate 10 surface is coated with a silicon group organic metal diluted with toluene to form an adhesive film 3. Micro beads 1 are placed in the metal frame 2 and heated, and by giving the micro beads 1 prescribed positions for bonding, the fusion of adhesive film at the start of the heating automatically causes self-alignment between the micro beads and the metal frame, thus providing very accurate positions to the micro beads.
申请公布号 JP2000353824(A) 申请公布日期 2000.12.19
申请号 JP19990165478 申请日期 1999.06.11
申请人 STANLEY ELECTRIC CO LTD 发明人 TAMURA HIROMOTO
分类号 H04N1/036;C09J5/00;H01L33/08;H01L33/58;H01S5/022 主分类号 H04N1/036
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