| 摘要 |
PROBLEM TO BE SOLVED: To increase bonding force between terminals, which are electrically connected to the electrode pads of a semiconductor chip and conductors which connect the terminals to a mounting substrate, by exposing the terminals from a resin by prescribed heights. SOLUTION: The thickness of a resin 105 is made equal to the heights of posts 104. In addition, grooves 106 are formed around the posts 104 in the resin 105. Consequently, the front end faces and partial peripheral wall surfaces of the posts 104 are exposed from the resin 105, and the peripheral wall surfaces of the posts 104 are exposed by the heights which are equal to the depths of the grooves 106. Then solder poles 107, which are formed as metallic electrodes, are formed in such a way that the poles 107 are bonded to the front end faces and partial peripheral wall surfaces of the posts 104 exposed from the resin 105. Since the solder poles 107 are not only bonded to the front end faces of the posts 104, but also to the peripheral wall surfaces of the posts 104, the bonding forces between the posts 104 and solder poles 107 are increased. |
