| 摘要 |
PROBLEM TO BE SOLVED: To form a good pattern and to considerably enhance dry etching resistance while retaining high sensitivity and high resolving power. SOLUTION: The dry etching resistance of a photosensitive resin composition containing an alkali-soluble resin, a photosensitive material and 0.0001-1.0 pt.wt. fluorescent material based on 100 pts.wt. photosensitive material is enhanced by making the weight average molecular weight of the alkali-soluble resin at least 5% higher than that of an alkali soluble resin used in a photosensitive resin composition containing no sensitivity enhancer and having the same sensitivity as the above photosensitive resin composition. Since the fluorescent material has a high sensitivity enhancing effect, such a very small amount of the fluorescent material can enhance sensitivity and the sensitivity of the photosensitive resin composition lowered by the increase of the molecular weight of the alkali-soluble resin can be enhanced without lowering the drying etching resistance of the composition. |
