| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device, where a semiconductor substrate is fixed to a mounting member. SOLUTION: A semiconductor substrate 1 and a mounting member 2 are fixed by a solder material, consisting of a kind of substance selected at least from among a group of Sn, Ag, Cu, Ni, P, Bi, Zn, Au and In, and the Pi layer provided on the surface to be fixed of the semiconductor substrate 1 and a solder material are fixed directly. Since the excessive reaction between metals on the fixing surface can be prevented by a Pt layer, reliability of the junction between the semiconductor substrate 1 and the mounting member can be improved.</p> |
