| 摘要 |
An ultrasonic transducer assembly includes a transducer mounted in a housing, the transducer including a piezoelectric element and respective matching and backing layers formed on the opposite sides thereof, the transducer mounted in the housing encapsulated with a non-conductive potting material. A portion of the matching layer is removed, e.g., by etching, to expose a portion of an underlying electrode formed between the piezoelectric element and the matching layer. A portion of the non-conductive potting material between the etched portion of the matching layer and a signal wire disposed in the housing is also removed. The respective voided portions of the matching layer and non-conductive potting material are filled with an electrically conductive matching material to electrically couple the electrode, and, thus, the piezoelectric element, to the signal wire.
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