| 摘要 |
A multi-chip semiconductor encapsulation method, which includes the steps of (1) preparing a leadframe having a center blank area and parallel rows of pins around said center blank area, (2) preparing a substrate having a plurality of chip positioning zones at the center area of the back side wall thereof, a window respectively disposed at the center of each chip positioning zone, conductor elements respectively disposed at the top side wall thereof around each window, and peripheral rows of terminals, (3) preparing a plurality of chips each having a plurality of solder tips and then fastening the chips to the chip positioning zones at the substrate, (4) using conductor wires to connect the solder tips at the chips to the conductor elements at the substrate, (5) mounting the substrate in the center blank area at the leadframe and then connecting the terminals at the substrate to the pins at the leadframe respectively, and (6) encapsulating the assembly of the substrate, the leadframe and the chip into a multi-chip semiconductor.
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