| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic substrate composition which can be sintered at a low temperature of <=1,000 deg.C, and can simultaneously sinter a conductor circuit containing a low resistant metal such as Ag- or Cu-based metal as a main component. SOLUTION: This composition for ceramic substrates comprises 60 to 51 wt.% of ceramic powder such as alumina powder and 40 to 49 wt.% of borosilicate-based glass powder comprising 5 to 17.5 wt.% of B2O3, 28 to 44 wt.% of SiO2, 0 to 20 wt.% of Al2O3, and 36 to 50 wt.% of MO (MO is at least one compound selected from CaO, MgO and BaO). A ceramic substrate formed from the composition realizes a high mechanical strength, a low dielectric constant, a low loss and a high thermal expansion coefficient of >=6.0 ppm/ deg.C. |
