| 摘要 |
PROBLEM TO BE SOLVED: To obtain the manufacturing method of a film carrier, where the accuracy of the shape of sprocket holes formed at both ends of an insulating film tape is maintained, even during the manufacturing process of the film carrier to manufacture the film carrier, which is superior in the accuracy of the shape of the holes and the accuracy of an alignment of pad electrodes with wiring patterns. SOLUTION: Sprocket holes 3 and conductor layers 5 are respectively formed at both ends of an insulating film tape 11 with adhesive layers and on both surfaces of the tape 11 along the longitudinal directions of both ends of the tape 11, the layer 5 on one side of the tape 11 is treated by patterning, and apertures 6 are formed in the prescribed positions on the layer 5. A laser beam is irradiated on the tape 11 and the adhesion layer 2, using the layer 5 formed with these apertures 6 as a mask to form conducting holes 7 in the tape 11 and the layer 2, protective layers 8 are respectively formed on sprocket parts 4, and thin-film conductor layers are respectively formed in the holes 7 through direct plating. The layers 8 are subjected to peeling treatment to form metal conductor layers 9 in the holes 7 through electrolytic plating, the conductor layers 5 on both surfaces of the tape 11 are treated by patterning to form pad electrodes 5a and wiring patterns 5b on the upper and lower surfaces of the tape 11, and a film carrier is obtained.
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