发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE, CONDUCTIVE CONNECTION STRUCTURE AND CONDUCTIVE CONNECTION METHOD
摘要 PROBLEM TO BE SOLVED: To secure sufficient conductive connection by melting a conductive particle in an anisotropic conductive adhesive and to prevent the molten conductive particle from unnecessarily running out. SOLUTION: At the beginning, this anisotropic conductive adhesive 13 comprises a material obtained by dispersing conductive particles 15 of a metal material having a higher melting point than a hardening temperature of an insulating adhesive 14 in the insulating adhesive 14 of a normal epoxy resin. If first time heating and pressurizing is applied at a designated temperature of not less than the hardening temperature of the insulating adhesive 14 and lower than the melting point of the conductive particle 15, the insulating adhesive 14 is hardened, however, the conductive particle 15 is not melted. If second time heating and pressurizing is applied at a designated temperature of not less than the melting point of the conductive particle 15, the hardened insulating adhesive 14 functions as a dam, and the melted conductive particle 15 can be prevented from unnecessarily running out.
申请公布号 JP2000353424(A) 申请公布日期 2000.12.19
申请号 JP19990165425 申请日期 1999.06.11
申请人 CASIO COMPUT CO LTD 发明人 OZAKI SHIRO;EDASAWA KENJI;SUGIYAMA KAZUHIRO
分类号 H01R11/01;C09J9/02;H01B1/22;H01B5/16;H01R4/04;H05K3/32;(IPC1-7):H01B1/22 主分类号 H01R11/01
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