发明名称 |
FILM RELEASING METHOD AND FILM STICKING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the consumption of an adhesive material by releasing the ends of cover films by the adhesive material and then delivering the ends of the cover films to a clamping device and continuously releasing the cover films from a multilayer film after separating the adhesive material from the cover films. SOLUTION: Respective bases 1 are carried at intervals L1 on a carrying roll 2 constituting a carrying line, and perforations are formed in the width direction of films from a film roll 3 by a perforation forming unit 7. Then cover films 6 corresponding to sections required for sticking the films are released by a cover film release unit 22, and resist films 5 are pressure bonded on the bases 1 by the pressure rollers 16a and 16b. As the cover films 6 still remain on sections L2, on which the sticking on the bases is not required, the resist films 5 can be pressure bonded only on the required sections of the bases. Thus the quantity of the adhesive material 13 (adhesive type) consumed when cover films 6 are released can be reduced.</p> |
申请公布号 |
JP2000351191(A) |
申请公布日期 |
2000.12.19 |
申请号 |
JP19990165845 |
申请日期 |
1999.06.11 |
申请人 |
HITACHI TECHNO ENG CO LTD |
发明人 |
NUMAJIRI FUMIAKI;MOMOCHI HIDEKAZU |
分类号 |
H05K3/28;B29C65/78;B32B43/00;(IPC1-7):B32B35/00 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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