发明名称 THERMOSETTING RESIN COMPOSITION AND THERMOCONDUCTIVE MOLDED PRODUCT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a lightweight, namely, low-specific gravity thermosetting composition having a certain level of thermal conductivity and infusible even at high temperatures, and to obtain a thermoconductive molded product using the above composition. SOLUTION: This thermoconductive molded product with a thermal conductivity of >=0.30 W/m.K is obtained by heating and curing the other objective thermosetting resin composition comprising 100 pts.wt. of a thermosetting resin and 2-200 pts.wt. of polybenzazole staple fibers each <=10 mm in length.
申请公布号 JP2000351909(A) 申请公布日期 2000.12.19
申请号 JP19990166089 申请日期 1999.06.11
申请人 POLYMATECH CO LTD 发明人 KOJIMA HIDEAKI
分类号 C08J5/04;C08L79/06;C08L101/00;C08L101/16;(IPC1-7):C08L101/16 主分类号 C08J5/04
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