Chip-type electronic device

摘要

A chip-type electronic device has a sintered ceramic body formed by integrally sintering a plurality of ceramic layers, inner electrodes including first electrodes, second electrodes and a third electrode formed inside this sintered ceramic body and outer electrodes formed on both end surfaces of this sintered ceramic body. One end of each of the first electrodes is electrically connected to one of the outer electrodes. Each of the second electrodes is electrically connected to a corresponding one of the first electrodes through an associated one of throughholes through one of the ceramic sheets. The third electrode is electrically connected to the other of the outer electrodes and overlaps with the second electrodes as seen perpendicularly to the planar inner electrodes. The second electrodes are wider than the first electrodes, and the other end of each of the first electrodes is at a position longitudinally between the second electrode and the other of the outer electrodes such that no variations will result from inaccuracies in the formation of the electrodes or the placements of the ceramic sheets.