发明名称 METHOD AND APPARATUS FOR WASHING WAFER EDGE
摘要 PROBLEM TO BE SOLVED: To effectively remove residues and deposited substances from a disk edge without causing undesirable effects on the main surface of the disk. SOLUTION: In one embodiment, the edge of a disk is so rotated as to be brought into contact with an etching agent by an applicator 13 doped with the etching agent or by a trough (which may contain one or more transducers) and a continuous part is scanned to pass through the trough or to pass through the applicator 13. In order to prevent the etching agent from getting into contact with the main surface of a substrate and/or to prevent excessive etching, the edge of the disk is brought into contact with a rinsing fluid (for example, by using a rinsing fluid nozzle or a trough filled with the rinsing fluid). In another embodiment, substances such as residues or particles are removed using a trough containing a rinsing fluid to which sound energy is applied.
申请公布号 JP2000350967(A) 申请公布日期 2000.12.19
申请号 JP20000095603 申请日期 2000.03.30
申请人 APPLIED MATERIALS INC 发明人 REDEKER FRED C;BROWN BRIAN J;SUGARMAN MICHAEL
分类号 B08B1/00;B08B3/02;B08B3/04;B08B3/08;B08B3/12;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):B08B1/00 主分类号 B08B1/00
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