| 摘要 |
<p>An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.</p> |
