| 摘要 |
The present invention relates to use of an inhibitor compound in an organosilicon composition for inhibiting curing of the organosilicon composition by a hydrosilylation reaction at a temperature of 40° C. to 100° C., or 100° C. and above, and a pressure of 1x10<6 >N/m<2 >to 5x10<6 >N/m<2>, or 5x10<6 >N/m<2 >and above. In a preferred application the organosilicon composition cures to form a silicone gel or elastomeric seal or plug within an oil or gas well. Preferred inhibitor compound is 1-ethynyl-1-cyclopentanol or 1-ethynyl-1-cyclohexanol. |
