发明名称 WAFER PLATE HAVING AN ELASTIC MATERIAL AS A WAFER SUPPORTING UNIT
摘要 PURPOSE: A wafer plate having an elastic material as a wafer supporting unit is provided to prevent damage to a wafer or pin and to prevent productivity from being deteriorated by stopping a unit process, by using the wafer plate in an apparatus for manufacturing a semiconductor device wherein a process can be performed by a wafer unit. CONSTITUTION: A wafer plate(12) having an elastic material is established in an apparatus for manufacturing a semiconductor device in which a wafer is processed by a wafer unit. In the wafer, plate on which the wafer is settled while the process is being carried out, the elastic material for horizontally supporting the wafer is established during the process. The elastic material is a spring pin composed of a spring.
申请公布号 KR20000074614(A) 申请公布日期 2000.12.15
申请号 KR19990018664 申请日期 1999.05.24
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 SHIN, HYEONG SEOK
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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