SEMICONDUCTOR PACKAGE AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to form a semiconductor package of an ultra thin film, by forming a penetration hole of a constant width on a circuit board thinner than the semiconductor package, and by positioning a semiconductor chip in the penetration hole. CONSTITUTION: A circuit board(10) is prepared which has a plurality of bond fingers(12) and ball lands(15), and includes a penetration hole(18). A semiconductor chip(2) having a plurality of input/output pads(4) on a surface is positioned in the penetration hole of the circuit board. The input/output pad of the semiconductor chip is electrically connected to the bond finger of the circuit board. A predetermined region of the semiconductor chip, connection unit and circuit board is encapsulated with encapsulating resin(20). A conductive ball(30) is melted and adhered to the ball land of the circuit board to form an input/output terminal.