| 摘要 |
PROBLEM TO BE SOLVED: To secure a bonding pad area, and to improve wire bondability and manufacturing yield. SOLUTION: This light emitting array device is provided with a semiconductor substrate 12, a plurality of light emitting element parts 11 linearly arranged with prescribed pitches, and individual electrodes 20 for inputting driving signals. Each individual electrode 20 is constituted of a connecting part 21 to be ohmic- connected with the light emitting element 11, a bonding pad 22 to be connected with an outside driving circuit, and a wiring part 23 to be led from the connecting part 21 to the bonding pad 22, and the bonding pads 22 are arrayed in a plurality of stages. Then, as for each wiring part 23 of each individual electrode 20, the wiring width of a part 23-b adjacent to the bonding pad 22 is formed so as to be thinner than the wiring width of a part 23-a at a part other than the part where the bonding pad is arranged. |
