STRETCHING DEVICE OF WAFER SHEET AND METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide the stretching device of a wafer sheet of a structure, wherein a looseness is not caused in the wafer sheet subsequent to a stretching of the wafer sheet and a break in a chip is never generated. SOLUTION: This stretching device has a wafer sheet 1 consisting of a heat- shrinkable sheet, a wafer ring 102 mounted with the sheet 1, and a shrinking means (heating means) 2 which fixes a wafer 103 on the ring 102, in a state that the wafer 103 is pasted to the sheet 1 and makes a shrinkage cause in the sheet 1 along the inner side of the ring 102.