| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent air from getting into between an adhesive material and an object to be stuck, when the adhesive material is stuck to the object. SOLUTION: An adhesive material sticking device 10 is provided with a device body 12, the inside of which is evacuated to a vacuum state, an adhesive material holding stage 17 which vertically movably holds an adhesive material 16, while the adhesive tape 15 of the material 16 is stuck to one surface of a semiconductor wafer 14, and a substrate supporting member 21 on the upper end edge of which a substrate 19 can be set up. When a lid body 26 is placed on a bottom plate 25 after the substrate 19 is set up on the supporting member 21, the internal space of the device body 12 is divided into first and second vacuum chambers 36 and 37. From this state, the central region of the substrate 19 is partially stuck to the adhesive surface 15A of the adhesive material 16, by only gradually raising the pressure in the second vacuum chamber 37 from a prescribed vacuum pressure after the first and second vacuum chambers 36 and 37 are set at the prescribed vacuum pressure. Thereafter, the adhesive holding stage 17 is raised, and the surface of the substrate 19 which is not stuck to the adhesive material 16 is brought gradually closer to the sticking surface 15A of the adhesive material 16 and is stuck to the material 16 as a whole.</p> |
